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Fraunhofer IZM
Fraunhofer Gesellschaft (FhG) is the world’s largest contract research organisation and undertakes applied research of direct utility to private and public enterprise and of wide benefit to society. At present, Fraunhofer Gesellschaft maintains more than 80 research institutions and institutes with a total staff of about 18,000 scientists, technical and administrative personnel. In this project, Fraunhofer society will participate with its Research Institution for Modular Solid State Technologies EMFT. The Fraunhofer EMFT develops application-oriented system technologies, in particular in the field of microelectronics and microsystems engineering.
Its Fraunhofer Institute for Reliability and Microintegration FIZM was founded in 1993 and is today one of the global leaders in microelectronics and Microsystems packaging. FIZMs main activities encompass research and development in the field of microelectronic packaging. The focus lies mainly on material, process and substrate development, characterization and simulation, advanced system engineering, assembly and interconnection technologies and environmental engineering. FIZM is employing about 350 employees and graduate students with its main branch in Berlin. Together with its partner institute at the TU Berlin, FSP-TdM, it is running a ~800m2 clean room of with full thin film and packaging capabilities from 4” to 12” wafers.
Since late ´90, FIZM is involved in the area flex substrate interconnect and integration especially with thin and extremely thin chips. IZM pioneered the concept of thin chip integration into substrates, both rigid and flex and has –together with its partner institute TUB- made substantial contributions to thin chip packaging also in EC funded projects (STELLA, PASTA, Cochise, Cajal4EU).
In the medical field, FIZM was pioneer in using chip to flex for novel pace maker solutions, brain computer interfaces with flex interposers, MEMS-to-Flex assembly, as well as body area network solutions for telemedicine using stretchable flexible substrates based on polyurethane.
FIZM has contributed to the evolution of the 3D TSV stacking industry, having also established a 12” capable research fab in Dresden (“ASSID – All Silicon System Integration Dresden”).
CT sensors have been integrated by FIZM by employing flip chip microbumps enabling to process the sensitive scintillator-chip combinations with high pin count capability. On such pixel sensors, FIZM was the remaining supplier for the LHC “ATLAS” detector, enabling the detection of the Higgs-Boson.
Since 7 years, FIZM is developing integrated solutions for microfluidic lab on chip and cell handling/monitoring. A cell laboratory with the capability to store, handle and incubate cells on technical substrates has been established in 2010 and is operated continuously.
With access to 800m2 of research cleanroom in Berlin and a fully fabrication ready 12” TSV-line in Dresden FIZM positions itself in the position of Europe´s premier packaging and system integration institute. The expertise from backend processing to full system integration combined with equipment and infrastructure to fabricated stretch-flex substates down to 10µm with 2µm lines/spaces, work with 5µm thin chips and handle thinned 12” wafers makes FIZM a unique European asset to high density system integration.
FIZM will bring in its strong expertise in the thin chip processing, interconnect and assembly technology for thin chip on flex and TSV stacking. Also, the handling and integration of extremely sensitive substrates (i.e. scintillator and detector crystals) with ultrahigh contact pin-out will be offered to the INFORMED consortium.
Its knowhow in lab on chip manufacturing (milling, embossing, additive technologies) with integrated sensors and actuators as well as biocompatible stretch-flex substrates will serve well to the monitoring of cell growth as well as to the detection of pathogens in body fluid samples.
made with love from - No Festival
made with love from - No Festival