image49  image50  Untitled 122  Untitled 12  image53  image54 image55   image56  image57 image58 
 image59  Untitled 1  image61  image62  image63  image65  image66  image67  image68  image69
 image80  image71  image72  image70  image74  image79  image76  image77  image78  Untitled 12222222
     image82  image84  SPTS2  top logo Lust neus  image81      
Aalto University is a multidisciplinary scientific and arts community, working in the fields of technology, business and art. It was founded in 2010, when Helsinki University of Technology, the Helsinki School of Economics and the University of Art and Design Helsinki were merged.
Electronics Integration and Reliability (EILB) belongs to the Department of Electrical Engineering and Automation at Aalto University School of Electrical Engineering. EIR is operating in Micronova, which is Finland's National Research Infrastructure for micro- and nanotechnology, jointly run by Aalto University and VTT Technical Research Centre of Finland.
EILB is specialised in the reliability of high density electronics, new interconnection chemistries, 3D integration technologies as well as in electrical, thermal, thermo mechanical and physicochemical modelling of the reliability of interconnections in component, packaging and system levels. The group utilizes the micro fabrication tools at Micronova and it has its own reliability testing laboratory including equipment for environmental, mechanical and thermo(mechanical) testing as well as materials characterization equipment.
Electronics Integration and Reliability (EILB) has over 20 years of experience in studying interactions and interfacial reactions between dissimilar materials, such as different oxide and nitride materials (Al2O3, Si3N4,TiN, AlN), metals and semiconductors. The group has published in this time more than 200 scientific articles from this field. EILB has developed a combined methodology approach to solve multi-materials compatibility issues in microelectronics and microsystems. This approach is based on thermodynamics of materials, reaction kinetics, and theory of microstructures as well as stress and strain analysis, and it is presented in the book authored by the senior scientists of the group “Interfacial Compatibility in Microelectronics – Away from Trial and Error methods” (ISBN 978-1-4471-2470-2). The research work of EILB is internationally recognized in the field of electronics reliability which is also reflected in their numerous cooperation projects with the national and international electronics and sensor manufacturing companies.
The background and the methodological expertize of EILB is well-suited for characterization of multi-material SOI structures and their reliability studies.
made with love from - No Festival
made with love from - No Festival